Plating

Products

Finely-tuned response to the needs by continuous plating processing equipment of industry eminent scale

"Function plating" gives various characteristics which are the chemical characters such as the corrosion resistance, the electrica! specification such as the electromagnetic radiation shields by giving plating to various metallic materials such as stainless steels and the copper base alloys. It is a trait that HYGENTE treats "continuous plating" that gives the plating processing in a continuous process to the metallic material and the press material rolled like the coil. Because of various process lines continuously being plated the processing, HYGENTE is able to correspond promptly corresponding to the customer’s requirements along with a target specification.
Moreover, the effect of raising the additional value to the cost saving by doing the plating processing that puts the high-value-added metal material of gold and silver on the surface of the material can be expected.Moreover, precise area plating where required for additional value materials such as precious metals,advantages of fusion of material properties and plating metal properties,we propose cost saving, short term delivery, and process improvement to customers such as slit process and lead frame cutting process for plated products.

Gold Plating

Suitable to the center from which an absolute function and the quality are requested.

The decoration plating is known to gold of preeminent corrosion resistance and beautiful luster. HYGENTE deals with the function plating such as connectors. Due to the steadiest metal, it contributes to the key function built into the safety device and the accelerator control system such as the car air bags from which certain safety is requested.

  • Material specification that can be gold plating

    Material: Copper, copper base alloy, SUS, and 42 alloys
    Size: Board thickness 0.1~0.8mm, Width 10~60mm

    Plating specification

    Groundwork: Copper and nickel
    Compound plating Two colored plating of Sn and RSn
  • Advantages

    ・ Low contact resistance
    ・ Good bondability
  • Disadvantages

    ・ High metal cost -> Measures: Partial plating

Silver Plating

The light of the shine contributes to the frontier industry.

[ Silver Plating for Semiconductor ]

Excellent silver in electro conductive is suitable for the bonding of the gold wire besides soldering. Reflectivity pulls out the crowd in a metallic material, and it is multi-used to the package for high luminance LED which contains reflector.

  • Material specifivation that can be silver plating

    Material: Copper, copper base alloy, 42 alloys, and iron
    Size: Board thickness 0.1~2.0mm, Width 10~100mm

    Plating specification

    Groundwork: Copper and nickel
    Silver luster level: Luster, half luster, and no luster
  • Advantages

    ・ Low contact resistance
    ・ Good bondability
  • Disadvantages

    ・ Sulfur discoloration -> Measures: Anti-sulfur treatment

Hard silver that improves hardness supports functions of the engine.

[ Silver Plating for Terminal ]

Silver with a high melting point is suitable for parts in the engine circumference of the automotive exposed in the high temperature. Hard silver that improves hardness is used also for the center parts of high technological product such as the hybrid engines corresponding to advanced needs in electricity and an electronic field.

  • Material specifivation that can be hard silver plating

    Material: Copper, and copper base alloy
    Size: Board thickness 0.1~1.5mm, Width 10~150mm
    The central career type terminal can be processed.

    Plating specification

    Groundwork:Copper and nickel
    Compound plating Two colored plating of Sn.

Nickel Plating

The shine and the functional property are made the best use of and it is multi-used to the electronic item.

It is a representative of chemical plating as weH as the copper plating. It is used for the production of the high voltage inverter which is best to the wire bonding of aluminum because it excels in the tolerance to a high temperature and a high voltage. It is often used as metallic plating for the electromagnetic radiation shield and the memory card cover because it excels also in lustrous extemals and the resistance to corrosion.

  • Material specification that can be Ni plating

    Material: Copper, copper base alloy, SUS, 42 alloys, iron and aluminum
    Overall plating: Board thickness 0.08~2.5mm,Width 10~300mm
    Partial plating: Board thickness 0.08~2.5mm, Width 10~290mm
  • Advantages

    ・ Excellent for heat resistance, corrosion resistance, abrasion resistance,color resistance.
  • Disadvantages

    ・ Bright thick plating of high hardness is easy to crack by bending. -> Measures: Matte tin plating.

Nickel plating for aluminum

Aluminum as a base material which has been considered difficult to plate, we stable supply nickel plating that suppression of the increase in contact resistance.

  • Materials that can be plated

    Material: 1000 series and 6000 series of high conductivity, high strength
    Size: Material thickness 0.6~4.0mm Width 150~300mm
    Coil weight: ~600kg (Coil outer diameter 1100 MAX)
    Plating thickness: Standard 2.0μm (MAX 5.0μm)

Tin Plating

Wide use for connector parts for cars, industrial use and multi- function usage

Wide use for connector parts for cars, industrial use and multi- function usage Plating with excellent tin in electro conductive, soldering, and corrosion resistance is suitable for the connector terminal which is required consistently certain and steady working. HYGENTE produces the plating for various usages such as the control boards of industrial equipment including for the car and the connector part for consumer electronic.

  • Material specification that can be tin plating

    Material: Copper, copper base alloy, SUS, 42 alloys, iron
    Overall plating: Board thickness 0.08-2.5mm, Width 8-300mm
    Partial plating: Board thickness 0.1-2.5mm, Width 10-100mm
  • Type of groundwork

    Copper and nickel

HYGENTE corresponds to a high density mounting by the risk reduction of groundwork whisker

[ Reflow Tin Plating ]

In a high density mounting corresponding to making high performance and a miniaturization of electronic parts, how to handle generating whisker (needle shape metallic crystal) that causes the short circuit failure becomes an issue.The reflow tin plating can decrease the risk by whisker.

  • Material specification that can be reflow tin plating

    Material: Copper, copper base alloy and SUS
    Overall plating: Board thickness 0.8-1.2mm, Width 10-300mm
    Partial plating: Board thickness 0.15-0.8mm, Width 10-65mm
    Line plating Size: 0.35-1.l4mm (Circle, corner/angle line)(Possible for rectangular wire)
  • Type of groundwork

    Copper and nickel